Application of tantalum-niobium plate

Tantalum niobium medium thick plate, as a refractory rare metal structural material, has the characteristics of high temperature resistance, corrosion resistance, high melting point, small expansion coefficient, etc., and its high temperature strength, high temperature toughness and processing performance are relatively good, widely used in chemical industry, aerospace, atomic energy, electronic information and other fields.

Due to its high conductivity and resistance to foreign atoms, large tantalum or niobium thick plates are mainly used for making sputtering targets (3-30mm thick).Tantalum targets are mainly used in semiconductor and optical fields, while niobium targets are mainly used in surface engineering materials, such as Marine, chemical, liquid crystal display (LCD) and other industries.

Sputtering is one form of physical gas deposition. In the sputtering process, energetic particles collide with the solid plate with high purity of the target material, and the atoms are smashed out according to the physical process. These atoms are pushed through the vacuum and finally form the deposition. The sputtering yield depends on the mass, energy, incident Angle and other factors of the bombardment ion. Magnetron sputtering adsorbent is mainly used to change the incident Angle of the bombardment particles. As the raw material of magnetron sputtering adsorbent, in order to obtain uniform film deposition rate, the tantalum-niobium target needs to strictly control its plate shape and internal structure (uniform structure, fine grain size and crystallographic orientation).Tantalum-niobium target is used to weld several products together. In order to reduce welding seam, the user requires more and more sizes of target materials.

The purity of tantalum sputtering target material is divided into three grades: 3N5 (purity 99.95%, grain size ≤150 m), 4N (99.99%, grain size ≤100 m) and 4N5 (purity 99.995%, grain size ≤100 m). The thickness of the main product is greater than 3.5mm, width less than 600mm, length less than 1500mm. Niobium target material purity ≥99.9%, niobium circular target material specification, diameter of 25-400mm, thickness of 3-28mm.Niobium square target specification, thickness 1-20mm, width 10-1000mm, length 200-2000mm.The product states of the sputtering targets above include annealed (M) and hard (Y), but the general requirement for use is that the inner part of the target is completely recrystallized (grain size ≤100 M).Shape flatness of niobium target ≤0.2mm, surface roughness ≤0.8 m.

At present, the international market for large tantalum-niobium medium and thick plates with width greater than 1000mm and length greater than 1400mm is in great demand. The advantage of wide-width panel over narrow-width panel is that the products prepared with wide-width panel have the least number of welds, which can reduce the products' failure and failure under long-term corrosion, stress and other working conditions and improve their service life.

Tantalum-niobium target Product Category:
(1) Tantalum sputtering target, purity ≥99.95%, target grain size ≤100 m, fluctuation range of grain size ≤20 m, welding bonding rate ≥95%, welding strength ≥135MPa, processing size accuracy of target and ring ≤0.05mm, surface roughness of target material ≤0.8 m, target and ring packaging purification degree of 100 grades. The products are mainly used for semiconductor chip coating;

(2) Niobium oxide sputtering target with Nb₂O_x chemical composition. The product is sputtering coating target material, mainly used for plasma display, touch screen, etc.

(3) Niobium sputtering target, plane specification, purity ≥99.9%, grain size ≤100 m, surface roughness Ra≤0.8 m. The product mainly USES in the display anti - reflection coating film.