Vacuum evaporation coating technology

Coating method can be divided into gas phase generation method, oxidation method, ion injection method, diffusion method, electroplating method, coating method, liquid phase growth method, etc. The gas phase generation method can be divided into physical vapor deposition, chemical vapor deposition and discharge polymerization.

Vacuum evaporation, sputtering coating and ion plating, commonly known as physical vapor deposition, are the basic film preparation techniques. They all require a certain vacuum in the space where the film is deposited. Therefore, vacuum technology is the basis of film production technology, to obtain and maintain the required vacuum environment, is a necessary condition for coating.

PVD is the abbreviation of Physical Vapor Deposition (Physical Vapor Deposition). It refers to the arc discharge technology with low voltage and large current under vacuum conditions. It uses gas discharge to vaporize the target material and ionize the vaporized material and gas. The vaporized material and its reaction products are deposited on the workpiece. PVD basic methods: vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive ion plating, radio frequency ion plating, DC discharge ion plating).